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ON Semiconductor Offers High-Q IPD Process Design Kit For Agilent's ADS
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Wednesday, June 20, 2012:
ON Semiconductor Corporation (Nasdaq: ONNN), a premier supplier of high performance silicon solutions for energy efficient electronics, has announced the availability of a full front-to-back process design kit (PDK) for its High-Q™ Integrated Passive Device process. The PDK was developed for use with Agilent Technologies’ Advanced Design System (ADS) 2011 EDA software and enables both ON Semiconductor and Agilent customers to take full advantage of the industry’s most comprehensive RF and microwave design platform.
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The High-Q™ IPD process technology from ON Semiconductor offers a copper on high resistivity silicon platform, ideal for the production of passive devices such as baluns, filters, couplers, diplexers and matching networks that are used in portable, wireless and RF applications. IPD technology supports fabrication of copper inductors, precision capacitors, and precision resistors at the company’s world-class 200 mm wafer manufacturing facility located in Gresham, Oregon. IPD provides a cost-effective solution for RF system in package. An economical foundry shuttle service is available for developing engineering prototypes. In addition, ON Semiconductor also offers design services for custom specifications across multiple applications.
"IPD processes have gained significant traction in RF applications and we see a strong interest from our customers for the expanded Agilent ADS platform support,” said Rick Whitcomb, senior director, Custom Foundry and IPD division at ON Semiconductor. "By offering a complete ADS design kit, including layout and integrated EM support, our customers now have the advantage of Agilent's proven expertise in RF and microwave design."
A full feature ADS design kit is available to customers for layout, simulation, and verification that supports schematic-driven layout creation, layout-versus-schematic check and integrated 3D planar electromagnetic and 3D-FEM simulators.
“ADS is a perfect fit for IPD processes and the combination of ADS and ON Semiconductor’s IPD design kit allows our mutual customers access to an effective, integrated design platform,” said Juergen Hartung, foundry program manager of Agilent EEs of EDA. “ADS not only provides a complete front-to-back implementation platform for the IPD die itself, but also directly enables design of the complete RF module in which the IPD is contained.”
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