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Exclusive Interview With Gina Wong, GLOBALFOUNDRIES
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"By joining Global 450 Consortium, it helps us to be in the forefront of anticipating and capitalizing on the demand shift of 300mm to 450mm when customer demand call for it."
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Monday, September 10, 2012:
With a gradual change in the size of the wafers from 300mm to 450mm looming on the IC industry, it seems there are some interesting challenges up ahead. EFYTimes approached Gina Wong from GLOBALFOUNDRIES to find out the primary challenges that were to be addressed in the process.
This is what she had to say:
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Having been a part of AMD previously, how does it help having the experience of being in foundry industry ?
Gina Wong: The former AMD manufacturing business was operated in the IDM model. By combining it with Chartered Semiconductor Manufacturing’s foundry business model, a business that we acquired in January 2010, we offer an excellent value proposition to our customers because of our intimate understanding of how IDM companies operate from our AMD heritage, combining it with the foundry expertise we acquired from Chartered.
What are the main challenges faced by the foundry industry today?
Gina Wong: The key challenge faced by the foundry industry today is to be able keep pace with the rapid changing demand for leading-edge technologies with the adequate Capex for capacity expansion and process know-how. In today’s foundry world, very few companies can do that. GLOBALFOUNDRIES with the strong financial backing of Advanced Technology Investment Company (ATIC) we have the right ingredients from capital investment to technological know-how to address these challenges.
Are there any plans for expansion by GLOBALFOUNDRIES anytime soon?
Gina Wong: Our manufacturing excellence spans across three key continents in the world – America, Europe and Asia. Our current focus is to expand our existing capacity in these three sites – Malta (New York), Dresden (Germany) and Singapore to serve the leading-edge market.
How does being a part of the Global 450 Consortium help in aiding the transition from 300mm to 450mm?
Gina Wong: By joining Global 450 Consortium, it helps us to be in the forefront of anticipating and capitalizing on the demand shift of 300mm to 450mm when customer demand call for it.
How do you think the transition from 300mm to 450 wafer size is going to play out in the coming future, in the semiconductor industry and what would be the concerned challenges?
Gina Wong: At the moment, we still see considerable headroom left in 300mm manufacturing and will continue to stay focused on driving efficiencies in this manufacturing process and associated tools, facilities and systems. On the other hand, there are still challenges such as tool specifications, configurations, fully-defined standards, etc. need to be addressed with 450mm manufacturing. Hence by working closely with our suppliers, other semiconductor manufacturers, and the consortium members, we are able to look into the issues early and be ready to offer the right solution when the market is ready.
Srinivas Nallani Chakravathi, EFYTIMES News Network
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