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4 Dec: National Conference On Electronics Design, Assembly And Reliability
4 Dec: National Conference On Electronics Design, Assembly And Reliability
(Thursday, June 14, 2012 2:15:08 PM)
--Press Release
Thursday, June 14, 2012:
IPC India is organizing a national conference and exhibition from 4 December to 6 December 2012 at the prestigious Indian Institute of Science, Bangalore, for the benefit of Indian industry. The event is conducted in technical cooperation with the Department of Electronic Systems Engineering (DESE), Indian Institute of Science, Bangalore.
CALL FOR PAPERS
Present your work at the IPC National Conference on Electronics Design, Assembly & Reliability and make an impact as an industry expert at this inaugural event.
As a speaker, you will be positioned as a subject matter expert in IPC communications distributed to a global audience and event participants. This is a unique and cost-effective channel for promoting your organization's capabilities and an opportunity to make a contribution to the industry.
Topics of interest Include - but are not limited to: IM1
Electronics packaging Electronics components and RF Emerging technologies including embedded passives and actives EMI/EMC design criteria CAD and signal integrity Interconnections on PWB and advanced PWB technologies, ceramic technologies Surface mount technology - design and manufacturing Materials and processing Cable and wire harness Design for ESD, manufacturing, reliability and test Yield and quality control in manufacturing Solders, lead-free solders and RoHS Electric test
Requirements for Submission
Your submission must be received by August 15, 2012:
An abstract of 250 to 300 words that summarizes recent technical work - case histories, research and discoveries Your professional biography Complete contact information
Your presentation should be noncommercial in nature and describe significant results from experiments, emphasize new techniques, discuss trends of interest or contain technical and/or appropriate test results. Suggested time for presentations is 25 minutes.
How to Submit
To submit your proposal for a conference agenda presentation, or to learn about conference participation, please email ncedar@ipc.org.
Timeline
August 15 - Your submission is due September 1- You will be notified regarding status of the proposal October 15 - Your print-ready full paper in PDF will be due to IPC
Benefits
Conference speakers will receive complimentary admission to the two-day conference and exhibition. Complimentary event proceedings & conference kit Opportunity for Networking among the leading technology experts Roster of participants
EXHIBITOR OPPORTUNITIES
This conference is a business development opportunity you do not want to miss! A brand new, high-profile conference featuring two full days of exposure to your prospects.
Build or reinforce your position as an industry leader by leveraging conference speaker opportunities to show off your company's latest technical research and innovations.
Network with colleagues, industry experts and more.
Gold Exhibitor
Speaking opportunity One technical conference session to share your solutions, best practices and case studies 3x3 m exhibit space Full page advertisement in conference proceedings Pre-conference marketing Logo on all printed materials and agenda on-site Logo on all electronic promotional material Logo on conference website Audio speaker interview produced by IPC for social media promotion List of conference attendees after the conference Two conference passes
Silver Exhibitor
3x3 m or 3x2 m exhibit space Half-page advertisement in conference proceedings Pre-conference marketing Logo on all printed materials and agenda on-site Logo on all electronic promotional material Logo on conference website List of conference attendees after the conference One conference pass
Attendees are looking for equipment, systems and supplies in these major product categories:
Adhesives, Coatings, Chemicals, and Materials Assembly Systems, Tools, and Fixtures - Automatic, Semi-Automatic, Manual Cleaning Equipment and Supplies - Aqueous, Ultrasonic Components - Active, Passive, SMT and Flip Chip Connectors, Sockets & Backplanes Drilling, Routing & Tooling EOS/ESD Packaging and Supplies Electronic Manufacturing Services (EMS)/Contract Manufacturing Enclosures/Cabinets Laminates and PCB Materials Material Handling Systems and Conveyors Pick and Place Equipment - Automatic, Semi-Automatic Printed Circuit Boards Production Hand Tools and Supplies Rework and Repair Tools and Kits Semiconductor Packaging Equipment Screen and Stencil Printing Services - Consulting and Training Solder Cream/Paste/Powder and Fluxes Soldering Equipment - Reflow, Wave, Infrared Tape and Reel Equipment and Supplies Test, Inspection and Measurement Equipment and Services
REGISTRATION
Conference admission
To register for workshops and/or the technical conference, please email ncedar@ipc.org
Register before August 31st and receive Early Bird rates! Early Bird technical conference rates will only be available to the first 100 registrants before August 31st! Early Bird Workshops rates will only be available for the first 50 registrants before August 31st!
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